In order to meet customer’s need for FPC module units, MEKTEC Group not only provides FPCs themselves but also mount surface parts,filip chips,and other components on FPCs.
We are supplying more than one million of FPC product with assembly to customers in worldwide everyday.
Technology |
Capability |
status |
SMT |
Passive component, connector
Min. component size: 0402(metric)
Min. connector pitch: 0.35 mm |
Mass production |
Small component, fine pitch connector
Min. connector pitch : 0.3 mm |
Proto |
Active device: QFP, QFN package
Min. lead pitch: 0.4 mm |
Mass production |
Active device : BGA, CSP package
Min ball pitch : 0.37 mm |
Mass production |
Flip chip |
Flip chip assembly (solder bump)
Min. bump pitch: 150 um |
Mass production |
Other |
Underfill, conformal coating |
Mass production |