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  • Double-sided FPC

    Standard FPC with two copper layers on both sides of the polyimide film.

    Features

    Allows for more intricate circuit designs than a single-sided FPC.

    Further space savings are realized by mounting components on both sides of the FPC.




    Basic structure



    Base Material
    Polyimide film   25μm(1mil)、12.5μm(1/2mil)
    Cu   12μm(1/3oz)、35μm(1oz)、17.5μm(1/2oz)
    Cover Material
    Polyimide film   25μm(1mil)、12.5μm(1/2mil)
    Resist ー
    Surface treatment Solder Electrolytic Plating
    Gold Electrolytic Plating
    Anti Corrosion(OSP)

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