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| Development of a multilayer board which is
composed of LCP (liquid crystalline polymer) to meet the higher frequency, thinner
multilayer board,and finer lines |
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- LCP with low dielectric dissipation factor ( tan
 =0.0025@1GHz
) is applied to avoid a dielectric loss on a high frequency signal
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| Z0=50Ω Trace length 50mm |
 |
frequency [GHz]
S21 Comparison data |
|
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- mono-material multilayer board can be realized by using LCP
. LCP is thermoplastic resin, so no adhesive is required for
stacking process
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| Cross section of four-layer board
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- A dimension change of pitch on finer multi-terminal can be
reduced,because of lower dimension change by moisture adsorption
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