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100% Polyimide material construction provides greater thermal reliability than our competitor's multilayered circuits. |
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This functional integration of the flex cable and rigid board eliminates connectors and saves space. |
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| (4 layers) |
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| Base material |
| Polyimide film |
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25um(1mil) , 12.5um(1/2mil) |
| Copper foil |
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17.5um(1/2oz) , 12um(1/3oz) |
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| Cover material |
| Polyimide film |
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25um(1mil) , 12.5um(1/2mil) |
| Resist |
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| Via |
| Through Hole |
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φ0.20mm～ |
| IVH |
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φ0.15mm～,
SVH φ0.10mm～ |
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| Surface treatment |
Gold Plating、OSP、Solder Plating |
| Layers |
3 to 8 layers |
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