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FPC can be bent and folded to promote customized and miniaturized
product packaging. |
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Fine pattern processing technology provides greater trace
density. |
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| |
 |
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Compact LCD, Camera module, etc |
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| |
 |
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Pattern enlarged (P=50 m) |
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 |
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Pattern cross section (P=50 m) |
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| Base
material |
| Polyimide film |
|
25 m (1mil) |
| Copper foil |
|
9 m (1/4oz) |
|
| Cover material |
| Polyimide film |
|
25 m
(1mil), 12.5 m
(1/2mil) |
| Resist |
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|
| Surface
treatment |
Gold Electrolytic Plating
Anti Corrosion(OSP) |
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