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 Component assembly on FPC
FLEXIBLE CIRCUIT - Flexible Printed Circuit -
Component assembly on FPC
Mektec group assembly site map
 
Assembly capability in Mektec
· Solder volume inspection is available
· 5D X-ray confirmation is available for BGA
· Available for underfill and conformal coating
· Electrical check is capable (ICT, functional test)
· Lead free and halogen free operation

Technology Capability status
SMT Passives component, connector
Min. component size: 0603(metric)
Min. connector pitch: 0.35 mm		 Mass production
Small component, fine pitch connector
Min. component size: 0402(metric)
Min. connector pitch : 0.3 mm		 Proto
Active device: QFP, QFN package
Min. lead pitch: 0.4 mm		 Mass production
Active device : BGA, CSP package
Min ball pitch : 0.37 mm		 Mass production
Flip chip Flip chip assembly (solder bump)
Min. bump pitch: 150 um		 Mass production
Flip chip assembly (Au bump)
Min. bump pitch : 50 um		 Mass production
Other Underfill, conformal coating Mass production
 
Functional test capability
Open/Short
Resistor & Capacitor test
B2B CN zero force connection
LED lighting test
Metal dome ON/OFF test
Switch ON/OFF test
I2C communication IC test
SPI communication IC test
Impedance test
VSWR test
MIC sensitivity test
MIC frequency response & THD
 
Products
Flexible printed circuits (FPC)
Single-sided FPC
Double-sided FPC
Single-sided Fine Pitch FPC
Double-sided Fine Pitch FPC
Flexible Durability of Standard FPCs
Hyper Flexible FPC
Shielded FPC
FPC Manufacturing Process Chart
Component assembly on FPC
Multilayer FPC
Precision Component Parts for Hard Disk Drive
New Technology
The application and trend of FPC
Company Profile
CSR
Contact Us
Sales Network
ISO9000 Series ISO14001 certified
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