 |
| Base
material |
| Polyimide film |
|
25 m (1mil), 12.5 m (1/2mil) |
| Copper foil |
|
35 m (1oz), 17.5 m (1/2oz) |
|
| Cover material |
| Polyimide film |
|
25 m (1mil), 12.5 m (1/2mil) |
| Resist |
|
 |
|
| Surface
treatment |
Solder Electrolytic Plating
Gold Electrolytic Plating
Anti Corrosion(OSP) |
|