 |
 |
 |
Small via hole processing technology allows higher density
component placement on both sides of the FPC. (land area =  0.3mm) |
|
Double-sided FPC allows more intricate appication
design. |
|
| |
 |
|
Compact LCD, Camera module, etc |
|
|
| |
 |
 |
| Via enlarged |
|
|
 |
 |
| Via cross section |
|
|
| |
 |
| Base
material |
| Polyimide film |
|
25 m (1mil) |
| Copper foil |
|
12m (1/3oz) |
|
| Cover material |
| Polyimide film |
|
25m
(1mil), 12.5m
(1/2mil) |
| Resist |
|
 |
|
| Surface
treatment |
Gold Electrolytic Plating
Anti Corrosion(OSP) |
|
| |
|
 |
|
