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>> Flex Buildup FPC |
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Combined with our multi-layered technology, this flexible circuit board has a build-up structure for higher density packaging including the option for CSP attachment. |
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(2C 1B) |
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Base material |
| Polyimide film |
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25 m(1mil),
12.5m(1/2mil) |
| Copper foil |
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17.5m(1/2oz), 12m(1/3oz) |
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| Cover material |
| Polyimide film |
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25m(1mil), 12.5m(1/2mil) |
| Resist |
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| Via |
| Through Hole |
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 0.20mm~ |
| IVH |
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0.15mm~ |
| Buildup Via |
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0.10mm~ |
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| Surface
treatment |
Gold Plating, OSP, Solder Plating |
| Layers |
3 to 4 layers |
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