| HOME
>> Flex Buildup FPC |
 |
 |
 |
Combined with our multi-layered technology, this flexible
circuit board has a built-up structure for higher density packaging including
the option for CSP attachment. |
|
| |
 |
(4C 1B) |
|
|
 |
| |
 |
|
Base material |
| Polyimide film |
|
25 m(1mil),
12.5m(1/2mil) |
| Copper foil |
|
35m(1oz), 17.5m(1/2oz) |
|
| Cover material |
| Polyimide film |
|
25m(1mil), 12.5m(1/2mil) |
| Resist |
|
 |
|
| Via |
| Through Hole |
|
 0.25mm~ |
| IVH |
|
0.25mm~ |
| Buildup Via |
|
0.15mm~ |
|
| Surface
treatment |
Solder Electrolytic Plating
Gold Electrolytic Plating
Anti Corrosion(OSP) |
| Layers |
6 to 10 layers |
|
| |
|
 |
|
