 |
| Base material |
| Polyimide film |
|
25 m(1mil),
12.5 m(1/2mil) |
| Copper foil |
|
35 m(1oz),
17.5 m(1/2oz) |
|
| Cover material |
| Polyimide film |
|
25 m(1mil),
12.5 m(1/2mil) |
| Resist |
|
 |
|
| Via |
| Through Hole |
|
0.25mm~ |
| IVH |
|
0.25mm~,
SVH 0.15mm~ |
|
| Surface treatment |
Solder Electrolytic Plating
Gold Electrolytic Plating
Anti Corrosion(OSP) |
| Layers |
3 to 10 layers |
|